Description
SPI uses optical and triangulation principle to check the state of solder paste printed, to analyse the adverse phenomenon in the production process and to privide quality production process.
Solder Paste Inspection (SPI)
Features
– Strong SPC management system, easy to read
– Fast and intuitive programming
– Two ways projection system, effectively eliminate the shadow
– True color 3D image
– MES data generation, online real-time monitoring of production
– Offline programming function real-time online testing while programming.
