Solder Paste Inspection (SPI)

Features

– Strong SPC management system, easy to read
– Fast and intuitive programming
– Two ways projection system, effectively eliminate the shadow
– True color 3D image
– MES data generation, online real-time monitoring of production
– Offline programming function real-time online testing while programming.

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Description

SPI uses optical and triangulation principle to check the state of solder paste printed, to analyse the adverse phenomenon in the production process and to privide quality production process.