Description
It is used in soldering process in the manufacture of printed circuit board (PCB).
Features
– Special strengthening wetting nozzle design ensures the best solder joint quality and prevents the solder dross from staining PCB.
– Special ultra-low oxygenation nozzle design. Solder dross is less than 2.5 kg every 8 hours.
– Solder pot made of 316L Stainless Steel or Iron based with Ceramic Plating or Titanium alloy ensure long life time and stability.
– Top and bottom cooling design ensure fast cooling.
– Whole course watching windows design, easy for watching and cleaning.
– Special flux spraying system design ensures long life time and stability.
– Special Flux Anti-dropping design.
– Over temperature protection.
– Motorized conveyor width adjustment
– Automatic feeding board
– Four zones preheating system
– Motorized solder pot run in/out system
– Motorized solder pot lift up/down system
– Modular Electrical Control Circuit Design.
– Unmatched uptime
– Ease of accessibility
– Alone flux spraying system is optional.
– Alone selective flux spraying system is optional。
Nitrogen Series
– Nitrogen environment for soldering process.
– Special strengthening wetting nozzle design ensures the best solder joint quality and prevents the solder dross from staining PCB.
– Solder pot made of 316L Stainless Steel or Iron based with Ceramic Plating or Titanium alloy ensure long life time and stability.
– Top and bottom cooling design ensure fast cooling.
– Whole course watching windows design, easy for watching and cleaning.
– Special flux spraying system design ensures long life time and stability
– Special Flux Anti-dropping design.
– Over temperature protection
– Motorized conveyor width adjustment
– Automatic feeding board
– Four zones preheating system
– Motorized solder pot run in/out system
– Motorized solder pot lift up/down system
– Modular Electrical Control Circuit Design.
– Unmatched uptime
– Ease of accessibility
– Alone flux spraying system is optional.
– Alone selective flux spraying system is optional.
It is used in soldering process in the manufacture of printed circuit board (PCB).