Air/Nitrogen Lead-free Reflow Oven

Features

– Side to side recirculation heating module design
– Independent blowing gas and returning gas circulation for the best heating stability.
– Advanced heat processing technology provides the best uniformity and repeatability. Best performance for 0201 and 01005 component soldering.
– Multiple technologies have been applied for patent protection
– Superior heating and cooling transfer performance
– Over temperature protection
– Automatic lubricating system
– Motorized rail conveyor width adjustment
– Flux Management
– UPS protection
– Unmatched uptime
– Ease of accessibility

Nitrogen Series

– Use open gas sampling port to ensure the monitoring of real Oxygen level.
– Advanced nitrogen shielding technology ensures ultra-low nitrogen consumption and
ultra-low using cost. The nitrogen consumption down to 15 cube meter per hour.

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Description

It is used primarily for reflow soldering of surface mounted electronic components to printed circuit boards (PCB).